Electronic communication functional filling materi
SJF-1091
Date：2022-06-21 Views：311
Specification
Low conductivity,Excellent insulation, Low magnetic foreign body,Electrical stability.
Application
Epoxy molding compound,High frequency board,Sealing loading plate, Copper clad dielectric packing,Electronic ink,water-based paint,Fine polishing,Precision casting.
Physical Characteristics
| Item | Unit |
SJF-1091 |
Test Method | |
| Average Particle Size | D50 | μm |
8~12 |
Laser particle size analyzer |
| Specific Surface Area |
m2/g |
1.3~2.5 |
Specific surface area analyzer | |
| Electrical Conductivity |
μS/cm |
≤10 |
Electrical Conductivity Meter | |
| PH |
/ |
5~8 |
PH Meter | |
| Whitenesse | % |
≧90 |
Whiteness Meter | |
|
Magnetic Foreign Matter |
mg/100g |
≤1.0 |
Adsorption weighing method |
|
Chemical Characteristics
| Item | Chemical compositions（%） | Test Method | ||
| SiO2 | Al2O3 |
Fe2O3 |
||
|
Specification |
≥99.6 |
≤0.2 |
≤0.02
|
Atomic Absorption Spectroscopy
|
SEM Image
Typical test data are listed in the above Tables unless otherwise specified.
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