Electronic communication functional filling materi
SJF-0020
Date：2022-06-21 Views：294
Specification
Low conductivity,Excellent insulation, Low magnetic foreign body,Electrical stability.
Application
Epoxy molding compound,High frequency board,Sealing loading plate, Copper clad dielectric packing,Electronic ink,water-based paint,Fine polishing,Precision casting.
Physical Characteristics
| Item | Unit |
SJF-0020 |
Test Method | |
| Average Particle Size | D50 | μm |
2.5±0.5 |
Laser particle size analyzer |
| Specific Surface Area |
m2/g |
8.0±2.0 |
Specific surface area analyzer | |
| Electrical Conductivity |
μS/cm |
≤30 |
Electrical Conductivity Meter | |
| PH |
/ |
6.5±1.5 |
PH Meter | |
| Whitenesse | % |
≧92 |
Whiteness Meter | |
|
Magnetic Foreign Matter |
mg/100g |
≤1.0 |
Adsorption weighing method |
|
Chemical Characteristics
| Item | Chemical compositions（%） | Test Method | ||
| SiO2 | Al2O3 |
Fe2O3 |
||
|
Specification |
≥99.5 |
≤0.2 |
≤0.02
|
Atomic Absorption Spectroscopy
|
SEM Image
Typical test data are listed in the above Tables unless otherwise specified.
